Leak-Free, Liquid-Cooled Heat Sinks

The data center sector is experiencing rapid growth—driven by cloud applications, digitalization, the Internet of Things, and 4G/5G edge computing. To meet increasing demands for performance and sustainability, CoolestDC turned to the advanced additive manufacturing (AM) technology from EOS.

Using the AMCM M 290 1kW system and the validated EOS Copper CuCP process (based on commercially pure copper), CoolestDC developed an integrated, leak-free, liquid-cooled unibody heat sink. This cold plate is built without joints, assemblies, or seals—and withstands water pressures of over 6 bar.

The AM process not only enables highly complex geometries but also allows for the production of ultra-fine internal structures starting at just 0.2 mm wall thickness. The patented angled fins are printed using an optimized process that ensures maximum precision and high-resolution features.

This innovative all-in-one solution eliminates potential leakage risks—which could otherwise cause critical server board failures—while significantly reducing manufacturing complexity by eliminating assembly steps and increasing the component's service life.

Key Benefits at a Glance:

• Leak-free unibody cold plate withstanding water pressure of 6+ bar
• Reduced CAPEX—no tooling costs for different server board layouts
• Design freedom for customized plate thicknesses, fin densities, and positions for optimized thermal performance
  
  

Read the full customer success story: Leak-Free Liquid Cooled Heat Sinks | EOS GmbH